Autor: |
Chantal G. Khan Malek, Harish M. Manohara, Supipta S. Das |
Rok vydání: |
1997 |
Předmět: |
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Zdroj: |
SPIE Proceedings. |
ISSN: |
0277-786X |
Popis: |
In thick photoresist applications, commercially available acrylic sheets are bonded to a substrate as an alternative to the casting and in-situ polymerization of PMMA. The factors affecting the adhesion of a thick acrylic sheet to different substrates have been studied. In case of copper and titanium substrates and bond-strength can be improved by roughening the surface through chemical oxidation which then provides a mechanical interlocking between the resist and substrate surfaces. Annealing of PMMA sheet before gluing and use of adhesion promoter such as organosilane further improves the bond strength at the resist-substrate interface. The resist adhesion to various substrates is evaluated by measuring the debonded length of the acrylic sheet during a mechanical cleaving test. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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