Analysis and enhancement of bond strength of acrylic sheets to metallic substrates for use in LIGA-type processing

Autor: Chantal G. Khan Malek, Harish M. Manohara, Supipta S. Das
Rok vydání: 1997
Předmět:
Zdroj: SPIE Proceedings.
ISSN: 0277-786X
Popis: In thick photoresist applications, commercially available acrylic sheets are bonded to a substrate as an alternative to the casting and in-situ polymerization of PMMA. The factors affecting the adhesion of a thick acrylic sheet to different substrates have been studied. In case of copper and titanium substrates and bond-strength can be improved by roughening the surface through chemical oxidation which then provides a mechanical interlocking between the resist and substrate surfaces. Annealing of PMMA sheet before gluing and use of adhesion promoter such as organosilane further improves the bond strength at the resist-substrate interface. The resist adhesion to various substrates is evaluated by measuring the debonded length of the acrylic sheet during a mechanical cleaving test.
Databáze: OpenAIRE