Autor: |
D.J. Werder, Mau-Chung Frank Chang, C.T. Liu, W.J. Sung, Y.K. Chen, R.F. Kopf, J. Chen, E.J. Zhu |
Rok vydání: |
2003 |
Předmět: |
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Zdroj: |
Proceedings. IEEE Lester Eastman Conference on High Performance Devices. |
DOI: |
10.1109/lechpd.2002.1146758 |
Popis: |
InP/InGaAs Heterojunction Bipolar Transistors (HBTs) have demonstrated excellent high-frequency performance and are widely used for optical fiber transmission. However, the current mesa HBT structure utilizes a very thick, highly doped n/sup +/InGaAs layer for the subcollector contact. This added mesa height makes multi-level interconnection processes more difficult, which impedes the capability of fabricating compact integrated circuits. In addition, InP has a much higher thermal conductivity than InGaAs, so heat dissipation may be a problem for densely packed circuits with the above structure. This paper reports on InP/InGaAs HBTs grown on Ge/P co-implanted substrates by Metal-Organic Molecular Beam Epitaxy (MOMBE). This embedded subcollector HBT structure offers several advantages for the fabrication of large-scale integrated circuits on InP substrates. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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