Die sinter bonding in air using copper formate preform for formation of full-density bondline
| Autor: | Yun-Ju Lee, Jong-Hyun Lee |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Full density business.product_category Materials science Metals and Alloys Oxide chemistry.chemical_element 02 engineering and technology Interface bonding 021001 nanoscience & nanotechnology Geotechnical Engineering and Engineering Geology Condensed Matter Physics 01 natural sciences Copper chemistry.chemical_compound chemistry 0103 physical sciences Materials Chemistry Shear strength Die (manufacturing) Formate Composite material 0210 nano-technology business Pyrolysis |
| Zdroj: | Transactions of Nonferrous Metals Society of China. 31:1717-1728 |
| ISSN: | 1003-6326 |
| Popis: | Pressure-assisted sinter bonding was performed in air at 250−350 °C using a preform comprising copper formate particles to form a bondline that is sustainable at high temperatures. H2 and CO generated concurrently by the pyrolysis of copper formate at 210 °C during the sinter bonding removed the native oxide and other oxides grown on bulk Cu finishes, enabling interface bonding. Moreover, Cu produced in situ by the reduction of Cu(II) accelerated the sinter bonding. Consequently, the bonding achieved at 300−350 °C under 5 MPa exhibited sufficient shear strength of 20.0−31.5 MPa after 180−300 min of sinter bonding. In addition, an increase in pressure to 10 MPa resulted in shear strength of 21.9 MPa after an extremely short time of 30 s at 250 °C, and a near-full-density bondline was achieved after 300 s. The obtained results indicate the promising potential of the preform comprising copper formate particles for high-speed sinter bonding. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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