Thermal and Mechanical Characterization of Electronic Packages in Extremely High Frequency Applications by Means of Finite Element Analysis

Autor:	B. Michel, R. Dudek, M. Boheim, W. Hager, J.-P. Sommer
Rok vydání:	1997
Předmět:	Electronic packages Reliability (semiconductor) Materials science business.industry Extremely high frequency Thermal Mechanical engineering Microelectronics business Three dimensional stress Finite element method Characterization (materials science)
Zdroj:	Thermal Management of Electronic Systems II ISBN: 9789401063180
DOI:	10.1007/978-94-011-5506-9_34
Popis:	The determination of possible failure mechanisms and advance in reliability are essential aims in modern micro electronics. Thermal and mechanical strength cannot be avoided in technological processes and under use. In general, this leads to three dimensional stress and strain fields with concentrations at special locations, e.g. at interfaces, edges, or material imperfections. One reason is the thermal mismatch between several materials that are combined in a package.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1afe4003059b329c5438c63b85e1c0ad https://doi.org/10.1007/978-94-011-5506-9_34 Zobrazit plný text záznamu