| Popis: |
This paper presents some results of our investigations in the integration of coils in LTCC using the Fodel® Technology as line patterning technology. Planar as well as 3-D inductors were simulated, manufactured, measured and modeled. The structures were manufactured with different shapes, a line width from 30 μm to 70 μm, a space between turns from 100 μm and 200 μm and diameters of inner turns from 0.5 mm to 2 mm. The smallest and most critical inductors (0.5 mm diameter) were manufactured with vias, whose diameter were about 60 μm. The manufacturing of smaller coils was possible due to the increased resolution of Fodel® thick-film inks also in inner layers in combination with micro vias, which were produced with a multifunctional Laser. Combining these technologies with buried cavities and a symmetric turn arrangement we obtained inductors that can be used in a wider range of frequencies (up to 10 GHz). |
