Structural alteration induced by substrate bias voltage variation in diamond-like carbon films fabricated by unbalanced magnetron sputtering
Autor: | Yuka Takagawa, Wenliang Zhu, Kazuyuki Arao, Junpei Kobata, Morimasa Nakamura, Giuseppe Pezzotti, Ken-ichi Miura, Elia Marin, Naomichi Nishiike |
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Rok vydání: | 2018 |
Předmět: |
Materials science
Diamond-like carbon Hydrogen chemistry.chemical_element 02 engineering and technology 01 natural sciences symbols.namesake 0103 physical sciences Materials Chemistry Electrical and Electronic Engineering Deposition (law) 010302 applied physics chemistry.chemical_classification Mechanical Engineering General Chemistry Sputter deposition 021001 nanoscience & nanotechnology Electronic Optical and Magnetic Materials Hydrocarbon Carbon film Amorphous carbon Chemical engineering chemistry symbols 0210 nano-technology Raman spectroscopy |
Zdroj: | Diamond and Related Materials. 90:214-220 |
ISSN: | 0925-9635 |
DOI: | 10.1016/j.diamond.2018.10.019 |
Popis: | Diamond-like carbon films/coatings (DLC) can be employed in a wide range of applications, but the film quality and performance are strongly dependent on the deposition conditions. In this paper, we attempted to clarify the structural and compositional alterations induced by substrate bias voltage (SBV) variation in DLC films by employing different spectroscopic analyses and to correlate them with the variations of two important film properties, hardness and adhesion energy. A series of DLC films fabricated by unbalanced magnetron sputtering with changing substrate bias voltage were investigated by Raman, FTIR and X-ray photoelectron spectroscopies. The results revealed the presence of sp2 and sp3 carbon chains and rings and various types of hydrocarbon in the tetrahedral amorphous carbon films due to incorporation of hydrogen and oxygen. The reduction in hydrogen content together with a generation of sp2 hydrocarbon rings in response to SBV increase were responsible for increases in Young's modulus and hardness, and, concurrently, for a decrease in film adhesion energy. |
Databáze: | OpenAIRE |
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