Microstructure and properties of a copper electrocontact material with a nanodispersed titanium dioxide additive
Autor: | E. G. Zelenkova, O. N. Ledyaeva, M. Yu. Kuchinskii, Galina M. Zeer, A. V. Sidorak |
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Rok vydání: | 2013 |
Předmět: | |
Zdroj: | Technical Physics. 58:710-714 |
ISSN: | 1090-6525 1063-7842 |
DOI: | 10.1134/s1063784213050253 |
Popis: | The influence of TiO2 nanopowder additive on the microstructure, physicomechanical properties, and performance characteristics of a copper-based composite is studied. The properties of the composites are compared with those of pure copper compacts. The microstructure and state of the composite’s working surface after performance tests are examined. It is shown that, when the amount of TiO2 grows, the hardness of the material rises and the arc quenching effect is enhanced. |
Databáze: | OpenAIRE |
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