Effect of In Addition on the Microstructure and Mechanical Properties of Sn-0.7Cu-0.8Zn/Cu Solder Joints

Autor:	Wenbin Tu, Shanlin Wang, Yuhua Chen, Like He, Chenggang Yang, Liming Ke
Rok vydání:	2023
Předmět:	Materials Chemistry Electrical and Electronic Engineering Condensed Matter Physics Electronic Optical and Magnetic Materials
Zdroj:	Journal of Electronic Materials.
ISSN:	1543-186X 0361-5235
DOI:	10.1007/s11664-023-10371-4
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1a6c3631b8e5a3229c781458022a48ab https://doi.org/10.1007/s11664-023-10371-4 Zobrazit plný text záznamu Full text from SpringerLink