MOCVD of Bi2Te3, Sb2Te3 and their superlattice structures for thin-film thermoelectric applications
| Autor: | T.S. Colpitts, Nadia A. El-Masry, Michael Lamvik, E Watko, Rama Venkatasubramanian |
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| Rok vydání: | 1997 |
| Předmět: |
Materials science
business.industry Superlattice Chemical vapor deposition Condensed Matter Physics Inorganic Chemistry Crystallography X-ray photoelectron spectroscopy Electron diffraction Seebeck coefficient Thermoelectric effect Materials Chemistry Optoelectronics Metalorganic vapour phase epitaxy Thin film business |
| Zdroj: | Journal of Crystal Growth. 170:817-821 |
| ISSN: | 0022-0248 |
| Popis: | The characteristics of metalorganic chemical vapor deposition (MOCVD) of Bi2Te3, Sb2Te3 and their superlattice structures are discussed in this paper. We have grown c-oriented films on both hexagonal sapphire and fcc GaAs substrates, with specular morphology and occasional stacking faults. Single crystallinity was confirmed by X-ray diffraction and low-energy electron diffraction (LEED). The stoichiometry (Bi:Te = 2:3, Sb:Te = 2:3) of the films were confirmed by X-ray photo-emission spectroscopy (XPS) and Rutherford back-scattering. We have also attempted to grow short-period (∼ 10 to 80 A) superlattice structures in the Bi2Te3Sb2Te3 materials system. X-ray diffraction data indicating the quality of these layered structures is presented. The advantages offered by the nature of chemical bonding in these materials, along the growth direction, for obtaining abrupt interfaces is discussed. The electrical transport properties of the MOCVD-grown p-type Bi2Te3Sb2Te3 structures and other thermoelectric properties including thermal conductivity and Seebeck coefficient are discussed. The initial results on the performance parameter known as figure-of-merit of the superlattice structures, measured parallel to the plane of the superlattice interfaces, are significantly higher than in conventional bulk materials. These initial results suggest a significant potential for MOCVD-based materials technology for high-performance, thin-film, thermoelectric refrigeration. |
| Databáze: | OpenAIRE |
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