Adhesion improvement of EMC–leadframe interface using brown oxide promoters
| Autor: | Lewis Chan, Charles J. Vath, Narasimalu Srikanth |
|---|---|
| Rok vydání: | 2006 |
| Předmět: |
Copper oxide
Materials science Delamination Metals and Alloys Oxide Surfaces and Interfaces Adhesion Molding (process) Surface finish Epoxy Surfaces Coatings and Films Electronic Optical and Magnetic Materials chemistry.chemical_compound chemistry visual_art Materials Chemistry Surface roughness visual_art.visual_art_medium Composite material |
| Zdroj: | Thin Solid Films. 504:397-400 |
| ISSN: | 0040-6090 |
| DOI: | 10.1016/j.tsf.2005.09.100 |
| Popis: | Moisture ingression in plastic packages essentially occurs through delaminated interfaces. Hence, package reliability depends on the interfacial integrity between the various materials. In the present work, the adhesion of epoxy-based molding compound and the copper leadframe is discussed. Results show that by the growth of a copper oxide layer, the surface roughness improves which promotes interlocking between the molding compound and leadframe during mold packing stage. Also by controlling the oxide thickness with pore-free structure, the adhesion strength can be significantly improved. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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