All lead free IGBT module with excellent reliability

Autor:	A. Morozumi, Yoshitaka Nishimura, E. Mochizuki, K. Oonishi, Yoshikazu Takahashi
Rok vydání:	2005
Předmět:	Substrate (building) Reliability (semiconductor) Materials science Thermal conductivity visual_art Soldering Metallurgy visual_art.visual_art_medium Mechanical engineering Ceramic Insulated-gate bipolar transistor Temperature cycling Thermal expansion
Zdroj:	Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005..
DOI:	10.1109/ispsd.2005.1487955
Popis:	The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT modules with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::193f9befef17736ab117c57f08e01843 https://doi.org/10.1109/ispsd.2005.1487955 Zobrazit plný text záznamu