Analysis on the Application of Envelope Systems Developed for Apartments by Using Mock-Up Test and Simulation Tools

Autor:	Hyung-Geun Kim, Ji-Yeon Kang, Suk-Won Lee, Goopyo Hong
Rok vydání:	2018
Předmět:	Mockup Computer science 020209 energy 021105 building & construction 0211 other engineering and technologies 0202 electrical engineering electronic engineering information engineering 02 engineering and technology Simulation Envelope (motion)
Zdroj:	KIEAE Journal. 18:17-24
ISSN:	2288-9698 2288-968X
DOI:	10.12813/kieae.2018.18.1.017
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::18feb1b35c4346fad485dbc510448121 https://doi.org/10.12813/kieae.2018.18.1.017 Zobrazit plný text záznamu