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The corrosion mechanism of copper at 373 and 300 K in the presence of submicron (NH[sub 4])[sub 2]SO[sub 4] particle deposits has been investigated. Several in situ techniques have been used to monitor the corrosion process in real time. At and above the critical relative humidity of (NH[sub 4])[sub 2]SO[sub 4], dissolution of Cu is followed by formation of Cu[sub 2]O, oxidation of Cu(I) ions to Cu(II) ions, and precipitation of antlerite [Cu[sub 3](SO[sub 4])(OH)[sub 4]], brochantite [Cu[sub 4](SO[sub 4])(OH)[sub 6]], or posnjakite [Cu[sub 4](SO[sub 4])(OH)[sub 6][center dot]H[sub 2]O]. The amount of corrosion product formed increases with amount of (NH[sub 4])[sub 2]SO[sub 4] particles, relative humidity (RH), and temperature. The in situ techniques allowed the authors to confirm and refine the individual steps in the multistep mechanism proposed in earlier work. |
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