| Popis: |
Process researching on high resolution and high ratio of depth to width of the negative photoresist (SU-8) process on micro-structure, by means of orthogonal experimental,drawing that the soft baking temperature and soft baking time have the greatest impact on the quality of the lithography. When the thick of photoresist is between 120μm with 340μm, the soft baking temperature is 90°C and the soft baking time is between 50min with 120min, the graphics quality is best. Then, analysis of characteristics of the ratio of high to depth on micro-structure electroforming shows that the mass transfer is the restrictive link of micro electroforming. Which can achieve the process parameters optimization of the lithography and electroforming micro-structure. |
