| Autor: |
Wiren D. Becker, Daniel M. Dreps, Pavel Roy Paladhi, Brian Samuel Beaman, Yanyan Zhang, Jose A. Hejase, Junyan Tang, Daniel Rodriguez, Sungjun Chun |
| Rok vydání: |
2020 |
| Předmět: |
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| Zdroj: |
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). |
| Popis: |
A comprehensive signal integrity model to hardware correlation study on an improved, 44 Gb/s capable, hybrid land grid array (HLGA) socket connector design is presented. The connector only design SI performance is shown through 3D electromagnetic (EM) modelling. Details of the test vehicle designed to carry out the connector hardware evaluation are shown. Simulation modelling and experimental results of the test vehicle inclusive of the connector are presented and compared. The systematic testing ensures that the new component performs up to its required specifications which ensures successful operation at the system level. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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