Migration of Copper through Tungsten-Filled Via on Single Damascene Copper Interconnect

Autor:	Sung-Kye Park, Jonghoon Oh, B. M. Seo, Byeongchan Choi, Juyeab Lee, Joo-Hwan Cho, Jong-sam Kim, Kwon Hong, Byung-Kook Kim
Rok vydání:	2010
Předmět:	Materials science chemistry Copper interconnect chemistry.chemical_element Nanotechnology Tungsten Copper
Zdroj:	Extended Abstracts of the 2010 International Conference on Solid State Devices and Materials.
DOI:	10.7567/ssdm.2010.h-6-2
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::18b8f8fcd3805c5262d4a5b46383b025 https://doi.org/10.7567/ssdm.2010.h-6-2 Zobrazit plný text záznamu