Effect of Trace Impurities on High-Cycle Fatigue Damage of Ultrafine Grained Copper Processed by Equal Channel Angular Pressing

Autor:	Seung Zeon Han, Terutoshi Yakushiji, S.S. Kim, Masahiro Goto, Norihiro Teshima
Rok vydání:	2008
Předmět:	Equiaxed crystals Pressing Materials science Mechanical Engineering Metallurgy chemistry.chemical_element Fatigue testing Condensed Matter Physics Hardness Fatigue limit Copper chemistry Mechanics of Materials Impurity Close relationship General Materials Science
Zdroj:	Materials Science Forum. :809-814
ISSN:	1662-9752
DOI:	10.4028/www.scientific.net/msf.584-586.809
Popis:	In order to study the effect of trace impurities on high-cycle fatigue damage of ultrafine grained (UFG) copper, fatigue tests were carried out for two samples: oxygen-free copper (OFC, 99.99 wt% Cu) and deoxidized low-phosphorous copper (DLP, 99.95 wt% Cu). After the processing by equal channel angular pressing (ECAP) using eight passes, equiaxed grains with an average size of 250 nm were formed for both the samples. Fatigue strength of UFG copper was enhanced by the impurities. The formation behavior of surface damage and the change in surface hardness was monitored. A close relationship was observed between the change in hardness and the formation behavior of surface damage. The physical background of the effect of trace impurities on the fatigue damage was discussed from the viewpoints of surface damage formation behavior.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1869fb32d9df3ebceb3963d4bf6f8fd9 https://doi.org/10.4028/www.scientific.net/msf.584-586.809 Zobrazit plný text záznamu