Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint

Autor:	Yi-Shao Lai, Wei Yu Chen, Tsung Chieh Chiu, Kwang-Lung Lin
Rok vydání:	2012
Předmět:	Materials science Mechanical Engineering Metallurgy Metals and Alloys Intermetallic Cold side Recrystallization (metallurgy) General Chemistry Electromigration Temperature gradient Electrical current Mechanics of Materials Soldering Materials Chemistry Flip chip
Zdroj:	Intermetallics. 26:40-43
ISSN:	0966-9795
Popis:	The electrorecrystallization, recrystallization driven by electrical current stressing, of Cu 6 Sn 5 intermetallic compound occurs in a Sn0.7Cu flip chip solder bump. The Cu 6 Sn 5 dissolves in Sn0.7Cu at 1.0 × 10 4 A/cm 2 of current stressing under 150 °C. The Cu flux in the solder joint, driven by the combination force of thermal gradient and electromigration, flows toward the cold side of the solder joint. The segregation of Cu results in recrystallization and thus redistribution of IMC at the cold side of the solder joint after current stops.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::185253e7bf9f40fe00c0b6d79adf01a2 https://doi.org/10.1016/j.intermet.2012.02.022 Zobrazit plný text záznamu Full Text from ScienceDirect