Studies and Application of Failure Analysis Technology for Semiconductor Advanced Processes

Autor:	Linhua Zhang, Younan Hua, Xiaomin Li
Rok vydání:	2022
Zdroj:	2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::17be0e345218fdf0288f34567446188e https://doi.org/10.1109/icept56209.2022.9873106 Zobrazit plný text záznamu