Wetting properties, recrystallization phenomena and interfacial reactions between laser treated Cu substrate and SAC305 solder
| Autor: | Zsolt Fogarassy, Zoltán Weltsch, Ágnes Cziráki, József Hlinka |
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| Rok vydání: | 2020 |
| Předmět: |
Materials science
General Physics and Astronomy Solder paste Recrystallization (metallurgy) 02 engineering and technology Surfaces and Interfaces General Chemistry 010402 general chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics Laser 01 natural sciences 0104 chemical sciences Surfaces Coatings and Films law.invention Contact angle law Soldering Wetting Laser power scaling Composite material 0210 nano-technology Metallic bonding |
| Zdroj: | Applied Surface Science. 501:144127 |
| ISSN: | 0169-4332 |
| DOI: | 10.1016/j.apsusc.2019.144127 |
| Popis: | Effect of laser treatment has been studied on the wetting ability of Cu substrate during soldering with SAC305 solder paste. The contact angle of molten solder drops on Cu substrate changes when the substrates treated with different Nd:YAG laser powers. The correlations between the extraordinary change of wetting angle and the surface interaction between the melt pool of solder alloy and Cu plates are studied. A texture formation was found in the laser treated Cu substrate, which supports the diffusion of the Sn atoms. The thickness of Cu3Sn interface layer is increasing with increasing laser power helping the formation of Cu6Sn5 phase, and resulting a better metallic bonding in solder joints. |
| Databáze: | OpenAIRE |
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