ChemInform Abstract: STUDY OF COPPER ELECTROPLATING FROM SULFURIC ACID SOLUTIONS. I. USE OF THE METHOD OF ISOSURFACE CONCENTRATION VOLTAMMETRY TO STUDY COPPER ION DISCHARGE

Autor:	L. E. Sribnyi, M. I. Donchenko, L. I. Antropov
Rok vydání:	1977
Předmět:	chemistry.chemical_compound chemistry Isosurface Inorganic chemistry Copper plating chemistry.chemical_element Sulfuric acid General Medicine Copper Voltammetry
Zdroj:	Chemischer Informationsdienst. 8
ISSN:	0009-2975
DOI:	10.1002/chin.197746026
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::177edd804957436d89bc4b19a36f2e0d https://doi.org/10.1002/chin.197746026 Zobrazit plný text záznamu Plný text