| Autor: |
Frederick Wu, Zvi Lando, Murali Narasimhan, Mohan K. Bhan, Ramanujapuram A. Srinivas, Brian Metzger, Fusen E. Chen |
| Rok vydání: |
1999 |
| Předmět: |
|
| Zdroj: |
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V. |
| ISSN: |
0277-786X |
| Popis: |
The TiCl4 based CVD-Ti process has been identified as the candidate of choice for the advanced contact metallization. A BKM wet clean recovery (WCR) procedure, involving extended chamber seasoning, has been developed for the CVD-Ti process. The new WCR methodology takes only 5 wafer processing to stabilize the CVD-Ti chamber condition and film properties. It has been found that a chamber seasoning for 200 sec, performed after every idle time (greater than 15 min.) and thermal periodic clean (at wafer count # 200), helps to maintain the CVD-Ti process performance. The reliability of the new chamber operating procedures was validated through a successful 3000 wafer marathon demonstration. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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