A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package

Autor:	Y. Takahahsi, Toshio Sudo, A. Sugimmoto, A.Kanno A.Kanno, S.Kaneko S.Kaneko, F. Kuwako
Rok vydání:	2008
Předmět:	Materials science business.industry Noise reduction Electrical engineering Decoupling capacitor Capacitance Dual in-line package law.invention Capacitor Chip-scale package law Hardware_INTEGRATEDCIRCUITS Quad Flat No-leads package business Decoupling (electronics) Hardware_LOGICDESIGN
Zdroj:	2008 Electrical Design of Advanced Packaging and Systems Symposium.
DOI:	10.1109/edaps.2008.4736002
Popis:	Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 ?F in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer circuits of the CPLD were simultaneous switched. Switching noise between the power and ground pads on the package has been dramatically reduced by the existence of high-density thin-film decoupling capacitance inside the package.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::16fe89e8f193e812250e3e5bb7fbe3b4 https://doi.org/10.1109/edaps.2008.4736002 Zobrazit plný text záznamu