Enabling Optical Performance on Challenging Materials via Chemical Mechanical Polishing

Autor:	Michael L. White, Kevin Moeggenborg, Stanley Lesiak, Stan Reggie, Daniel Mcmullen
Rok vydání:	2008
Předmět:	White light interferometry chemistry.chemical_compound Materials science chemistry Semiconductor device fabrication Chemical-mechanical planarization Optical materials Silicon carbide Magnetorheological finishing Polishing Nanotechnology
Zdroj:	Frontiers in Optics 2008/Laser Science XXIV/Plasmonics and Metamaterials/Optical Fabrication and Testing.
DOI:	10.1364/oft.2008.ofa2
Popis:	Chemical-mechanical polishing (CMP) was developed for semiconductor manufacturing to allow rapid, reproducible finishing of varied materials. This paper discusses the benefits and challenges of CMP for finishing of high-quality optical materials.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::16fc34496168cbdf88628ab6d03b9836 https://doi.org/10.1364/oft.2008.ofa2 Zobrazit plný text záznamu