Multichip module using multilayer YBa2Cu3O7−δinterconnects

Autor:	W. S. Ruby, Michael J. Burns, B. F. Cole, Kookrin Char, S. A. Sachtjen
Rok vydání:	1993
Předmět:	Very-large-scale integration Superconductivity Interconnection Materials science High-temperature superconductivity Physics and Astronomy (miscellaneous) business.industry Yba2cu3o7 δ Insulator (electricity) Epitaxy Die (integrated circuit) law.invention law Optoelectronics business
Zdroj:	Applied Physics Letters. 62:1435-1437
ISSN:	1077-3118 0003-6951
DOI:	10.1063/1.108652
Popis:	We report the first use of high temperature superconductors for multilayer interconnection of bare semiconductor die to form multichip modules. Ten die with a total of 160 pads were interconnected on a 3.4 cm2 substrate. The interconnections were a combination of YBa2Cu3O7−δ lines and vias on two wiring levels separated by an epitaxial insulating layer. Connection between the two YBa2Cu3O7−δ wiring layers was accomplished by the use of superconducting vias through the insulator. Two similar multilayer multichip module designs, with 30‐ and 10‐μm‐wide YBa2Cu3Oδ−7 lines, were constructed.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::16f1621b9afe8d55c43286bda2e98b2b https://doi.org/10.1063/1.108652 Zobrazit plný text záznamu