| Autor: |
Ulrich Dr. Strößner, Robert Birkner, Rigo Richter, Thomas Scherübl, Holger Seitz |
| Rok vydání: |
2008 |
| Předmět: |
|
| Zdroj: |
SPIE Proceedings. |
| ISSN: |
0277-786X |
| Popis: |
Recently more and more mask designs for critical layers involve strong OPC which increases the complexity for standard CD SEM mask measurements and conclusive interpretation of results. For wafer printing the wafer level CD is the crucial measure if the mask can be successfully used in production. Recent developments in the AIMS TM software have enabled the user to use the tool for wafer level CD metrology under scanner conditions. The advantage of this methodology is that AIMS TM does see the CD with scanner eyes. All lithographic relevant effects like OPC imaging which can not be measured by other tools like mask CD SEM will be captured optically by the AIMS TM principle. Therefore, measuring the CD uniformity of the mask by using AIMS TM will lead to added value in mask metrology. With decreasing feature sizes the requirements for CD metrology do increase. In this feasibility study a new prototype algorithm for measuring the lithographically relevant AIMS TM CD with sub pixel accuracy has been tested. It will be demonstrated that by using this algorithm line edge and line width roughness can be measured accurately by an AIMS TM image. Furthermore, CD repeatability and tool matching results will be shown. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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