Photosensitive Polyimide having low loss tangent for RF application
| Autor: | Akira Shimada, Hitoshi Araki, Yohei Kiuchi, Masao Tomikawa |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Permittivity Materials science business.industry 020208 electrical & electronic engineering Insulator (electricity) 02 engineering and technology Dielectric 01 natural sciences 0103 physical sciences Automotive Engineering 0202 electrical engineering electronic engineering information engineering Interposer Microelectronics Optoelectronics Dissipation factor Dielectric loss business Polyimide |
| Zdroj: | International Symposium on Microelectronics. 2018:000476-000482 |
| ISSN: | 2380-4505 |
| DOI: | 10.4071/2380-4505-2018.1.000476 |
| Popis: | Progress of 5G telecommunication and mm radar for autopilot, high frequency operation is required. Insulator materials having low loss at high frequency is desired for the applications. We designed the low dielectric constant, and low dielectric loss materials examined molecular structure of the polyimide and found that permittivity 2.6 at 20GHz, dielectric loss 0.002. Furthermore, in consideration of mechanical properties such as the toughness and adhesion to copper from a point of practical use. Dielectric properties largely turned worse when giving photosensitivity. To overcome the poor dielectric properties, we designed the photosensitive system. After all, we successfully obtained 3.5 of dielectric constant and 0.004 of dielectric loss, and 100% of elongation at break. In addition, we offered a B stage sheet as well as varnish. These materials are applicable to re-distribution layer of FO-WLP, Interposer and other RF applications for microelectronics. |
| Databáze: | OpenAIRE |
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