Photoresist ashing in nitrogen gas using ferrite core inductively coupled plasmas

Autor:	Wan Jae Park, Chung-Gon Yoo, Hyoun Woo Kim, Chin-Wook Chung, Dae-Kyu Choi, Chang-Jin Kang, Nam Ho Kim, Ju Hyun Myung
Rok vydání:	2005
Předmět:	Ashing Chemistry Analytical chemistry Plasma Fourier transform infrared spectroscopy Photoresist Inductively coupled plasma Condensed Matter Physics Instrumentation Plasma ashing Ferrite core Surfaces Coatings and Films Volumetric flow rate
Zdroj:	Vacuum. 80:193-197
ISSN:	0042-207X
Popis:	The characteristics of photoresist (PR) ashing using N 2 plasmas in a ferrite core inductively coupled plasma etcher have been studied and the effect of bias power and gas flow rate on PR ash rate and low- k material etch rate has been investigated. Fourier transform infrared spectroscopy revealed that the ashing process with N 2 gas produced less damage to the low- k material compared to the process with O 2 gas. The HF etch test was used to evaluate the ash damage to the low- k material.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1690792ea13d58cc5cfd16cb644ed581 https://doi.org/10.1016/j.vacuum.2005.08.009 Zobrazit plný text záznamu Full Text from ScienceDirect