1.6Tbps Silicon Photonics Integrated Circuit for Co-Packaged Optical-IO Switch Applications

Autor:	Christopher Seibert, Jonathan K. Doylend, Meer Sakib, Jian Chen, Summer R. Hollingsworth, Richard Jones, Sean McCargar, Catherine Jan, Zhi Li, Ling Liao, Kimchau N. Nguyen, Ranju Venables, Hari Mahalingam, John Heck, Randal S. Appleton, Frish Harel, Yuliya Akulova, Saeed Fathololoumi, Mohammad Montazeri, Reece A. Defrees, Hasitha Jayatilleka, Daniel Zhu
Rok vydání:	2020
Předmět:	Materials science Silicon photonics business.product_category business.industry 02 engineering and technology Integrated circuit Laser 01 natural sciences law.invention 010309 optics 020210 optoelectronics & photonics law 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Optoelectronics Network switch business
Zdroj:	OFC
DOI:	10.1364/ofc.2020.t3h.1
Popis:	We demonstrate 1.6Tbps Silicon Photonic Integrated Circuit (SiPIC) meeting co-packaged optics requirements for network switch applications. The SiPIC has sixteen 106Gbps PAM4 optical channels, including lasers, modulators and V-grooves. Post-FEC error-free operation over temperature is demonstrated.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::164c723856ab36de80e31db612a85ed7 https://doi.org/10.1364/ofc.2020.t3h.1 Zobrazit plný text záznamu