Fundamentals of Slurry Design for CMP of Metal and Dielectric Materials

Autor: Wonseop Choi, Kyu-Se Choi, Zhan Chen, Seung-Mahn Lee, Rajiv K. Singh, G. Bahar Basim, Brij M. Moudgil
Rok vydání: 2002
Předmět:
Zdroj: MRS Bulletin. 27:752-760
ISSN: 1938-1425
0883-7694
DOI: 10.1557/mrs2002.245
Popis: The formulation of slurries for chemical–mechanical planarization (CMP) is currently considered more of an art than a science, due to the lack of understanding of the wafer, slurry, and pad interactions involved. Several factors, including the large number of input variables for slurries and the synergistic interplay among input variables and output parameters, further complicate our ability to understand CMP phenomena. This article provides a fundamental basis for the choice of chemical additives and particles needed for present-day and next-generation slurry design. The effect of these components on nanoscale and microscale interaction phenomena is investigated. Methodologies are suggested for the development of next-generation slurries required to overcome CMP challenges related to defectivity and the surface topography of soft materials such as Low-κ dielectrics and copper.
Databáze: OpenAIRE