3D structures with piezoresistive sensors in standard CMOS

Autor: Ezekiel Kruglick, Jason W. Weigold, Eric G. Hoffman, B. Warneke, Kristofer S. J. Pister
Rok vydání: 2005
Předmět:
Zdroj: Proceedings IEEE Micro Electro Mechanical Systems. 1995.
DOI: 10.1109/memsys.1995.472608
Popis: Aluminum hinges and polysilicon piezoresistors have been fabricated in a standard commercial CMOS process with one maskless post-processing step. The hinges and piezoresistors are formed using the metal interconnect and transistor gate layers in the CMOS process. Xenon difluoride is shown to be a simple and effective alternative to standard bulk etchants for this process, because of its extreme selectivity and gentle gas phase etch. Preliminary results from a piezoresistive accelerometer are given.
Databáze: OpenAIRE