Autor: |
Z. Luo, N. Rovedo, S. Ong, B. Phoong, M. Eller, H. Utomo, C. Ryou, H. Wang, R. Stierstorfer, L. Clevenger, S. Kim, J. Toomey, D. Sciacca, J. Li, W. Wille, L. Zhao, L. Teo, T. Dyer, S. Fang, J. Yan, O. Kwon, D. Park, J. Holt, J. Han, V. Chan, J. Yuan, T. Kebede, H. Lee, S. Lee, A. Vayshenker, Z. Yang, C. Tian, H. Ng, H. Shang, M. Hierlemann, J. Ku, J. Sudijono, M. Ieong |
Rok vydání: |
2007 |
Předmět: |
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Zdroj: |
2007 IEEE Symposium on VLSI Technology. |
DOI: |
10.1109/vlsit.2007.4339709 |
Popis: |
An aggressively scaled high performance 45 nm bulk CMOS technology targeting graphic, gaming, wireless and digital home applications is presented. Through innovative utilization and integration of advanced stressors, thermal processes and other technology elements, at aggressively scaled 45 nm design ground rules, core NFET and PFET realized world leading drive currents of 1150 and 785 uA/um at 100 nA/um off current at IV, respectively. In addition to the high performance transistors, an ultra low-k back-end dielectric (k=2.4) significantly lowers wiring delay. In this technology, CMOS transistors with multiple-oxide thicknesses are supported for low leakage and I/O operations, and competitive SRAM is offered. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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