SLIM (TM), High Density Wafer Level Fan-Out Package Development with Submicron RDL
| Autor: | David Jon Hiner, Michael G. Kelly, WonChul Do, SangEun Park, Ji Hyun Kim, MinHwa Chang, AhRa Jo, Youngrae Kim, JaeHun Bae |
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| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Engineering Interconnection business.industry Fan-out 02 engineering and technology 021001 nanoscience & nanotechnology 01 natural sciences Die (integrated circuit) Reliability (semiconductor) Chip-scale package 0103 physical sciences Electronic engineering Wafer Routing (electronic design automation) 0210 nano-technology business Wafer-level packaging |
| Zdroj: | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC). |
| DOI: | 10.1109/ectc.2017.334 |
| Popis: | A novel HD-FO package platform was introduced with a hybrid RDL structure. An HD-FO package with hybrid RDL could enables higher routing density and multi die construction in a planner configuration. The 1-µm and submicron RDL wafers were fabricated at a foundry and then the essential parts of the inorganic RDL were integrated with Amkor's internal organic RDL process making a hybrid structure. Also, the vertical interconnection on a hybrid RDL made 3-dimentional package construction. Key processes including via reveal, top die attach, and vertical package stacking were successfully demonstrated. Technical challenges in HDFO package development was discussed as well as the reliability performance results both in the package and at the board level. |
| Databáze: | OpenAIRE |
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