Evaluation of the Quality of BGA Solder Balls in FCBGA Packages Subjected to Thermal Cycling Reliability Test Using Laser Ultrasonic Inspection Technique
| Autor: | Suresh K. Sitaraman, Jaimal Williamson, Vishnu V. B. Reddy, I. Charles Ume |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
Materials science
020208 electrical & electronic engineering 010401 analytical chemistry Ultrasonic testing Mechanical engineering 02 engineering and technology Integrated circuit Temperature cycling Laser 01 natural sciences Industrial and Manufacturing Engineering 0104 chemical sciences Electronic Optical and Magnetic Materials law.invention Quality (physics) Reliability (semiconductor) law Ball grid array 0202 electrical engineering electronic engineering information engineering Miniaturization Electrical and Electronic Engineering |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:589-597 |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2021.3065958 |
| Popis: | In modern integrated circuit (IC) packaging, it is difficult to perceive and evaluate the quality of the solder ball interconnections due to their complex hidden physical configuration and miniaturization. Laser ultrasonic inspection (LUI) technique is a novel, nondestructive, and noncontact method that has achieved great success in evaluating the quality of interconnections in chip-scale and ball-grid array (BGA) packages. In this article, an enhanced dual-fiber array LUI system is used to evaluate the quality of BGA solder balls in advanced industrial flip-chip BGA packages subjected to thermal cycling reliability tests. LUI results are validated with electrical testing, scanning electron microscope (SEM), and dye-and-pry results. LUI results are well correlated with the intermetallic compound cracks in BGA solder balls observed using SEM, and dye-and-pry. This study demonstrates the feasibility of using the LUI system for one of the modern IC packages and the potential to use the LUI system for future advanced IC packages such as 3-D packaging. |
| Databáze: | OpenAIRE |
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