High-temperature Resistant Interconnections Formed by Ni Nanoparticles/Al Micro-particles Composite Paste for SiC Power Device Application

Autor:	Yasunori Tanaka, Tatsumasa Wakata, Norihiro Murakawa, Tomonori Iizuka, Md. Mijanur Rahman, Kohei Tatsumi
Rok vydání:	2022
Zdroj:	Transactions of The Japan Institute of Electronics Packaging. 15:E21-004
ISSN:	1884-8028 1883-3365
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::150be24995addb5754eb568d7f8aa488 https://doi.org/10.5104/jiepeng.15.e21-004-1 Zobrazit plný text záznamu