High-temperature Resistant Interconnections Formed by Ni Nanoparticles/Al Micro-particles Composite Paste for SiC Power Device Application
Autor: | Yasunori Tanaka, Tatsumasa Wakata, Norihiro Murakawa, Tomonori Iizuka, Md. Mijanur Rahman, Kohei Tatsumi |
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Rok vydání: | 2022 |
Zdroj: | Transactions of The Japan Institute of Electronics Packaging. 15:E21-004 |
ISSN: | 1884-8028 1883-3365 |
Databáze: | OpenAIRE |
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