Design and analysis of nano-scale bulk FinFETs
Autor: | Jongmin Shin, Jong-Ho Lee, Kyu-Bong Choi |
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Rok vydání: | 2013 |
Předmět: | |
Zdroj: | ASICON |
DOI: | 10.1109/asicon.2013.6811940 |
Popis: | Design of 14 nm bulk FinFET is discussed and some properties are analyzed physically. The source/drain junction depth is the most important parameter to reduce off-current, and a punchthrough barrier of a peak concentration higher than ∼2×1018 cm−3 should be formed just underneath the junction depth at the same time. Uniform body doping concentration needs to be designed to have a doping in the range of 2∼4×1017 cm−3. The source/drain contact resistance can be reduced by increasing metal contact area on the source/drain region. The drain current fluctuation with the capture and emission of an electron in a trap inside the gate oxide is less than 2% at a V GS -V th of 0.1 V, and increases slightly due to the increase of coupling as fin width decreases. |
Databáze: | OpenAIRE |
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