Design, fabrication of honeycomb-shaped 1–3 connectivity piezoelectric micropillar arrays for 2D ultrasound transducer application
| Autor: | Joo Won Oh, Da Seul Shin, Seong Jin Park, Jin Man Jang, Yong Dae Kim, Jae Man Park, Sung Cheol Park, Jun Sae Han, Won Sik Lee |
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| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Fabrication Materials science Process Chemistry and Technology Plastics extrusion Mixing (process engineering) 02 engineering and technology Molding (process) 021001 nanoscience & nanotechnology medicine.disease_cause 01 natural sciences Piezoelectricity Surfaces Coatings and Films Electronic Optical and Magnetic Materials Mold 0103 physical sciences Materials Chemistry Ceramics and Composites Honeycomb medicine Composite material 0210 nano-technology Lithography |
| Zdroj: | Ceramics International. 46:12023-12030 |
| ISSN: | 0272-8842 |
| DOI: | 10.1016/j.ceramint.2020.01.243 |
| Popis: | As a core component of 2D ultrasound transducers, honeycomb-shaped 1–3 connectivity piezoelectric micropillar arrays have attracted enormous attention due to their unique performance and functionality. In this paper, honeycomb-shaped 1–3 connectivity piezoelectric micropillar arrays with a high aspect-ratio were designed and fabricated by means of deep X-ray lithography and powder injection molding in six steps: preparation of lost mold, powder-binder mixing, injection molding and demolding, removal of binders, and densification of powder. A polymer-based lost mold insert was generated by a synchrotron X-ray exposure and development process. The optimal volumetric ratio between the piezoelectric powder and binders was determined by torque rheology behavior, then they were homogeneously mixed with a twin extruder mixer. To fully fill in the micro-cavities of the lost mold, rheological properties of the mixture were analyzed with a capillary rheometer using different shear rates (50–5000 s−1) and temperatures (140 °C, 150 °C, and 160 °C). After the mixture was completely injected, the lost mold was chemically dissolved in acetone and rinsed in methanol without bending or clustering of the micropillar arrays during evaporation. The binders in the injection molded portion were thermally decomposed using a continuous heating schedule of 200 °C, 390 °C, and 600 °C in argon gas under atmospheric conditions. Finally, the particles in the sample were densified into a coherent, solid mass by eliminating pores at 1300 °C. Based on the proposed micro-manufacturing process, defect-free honeycomb-shaped 1–3 connectivity piezoelectric micropillar arrays with a pattern dimension of 42 μm and aspect-ratio of 5 were successfully produced. |
| Databáze: | OpenAIRE |
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