Plasma FIB: Enlarge your field of view and your field of applications
| Autor: | L. Hladík, T. Hrnčíř, Audrey Betty Marie Garnier, G. Filoni |
|---|---|
| Rok vydání: | 2015 |
| Předmět: |
Microelectromechanical systems
Engineering Emerging technologies business.industry Electrical engineering Field of view Large range Plasma Condensed Matter Physics Engineering physics Atomic and Molecular Physics and Optics Field (computer science) Surfaces Coatings and Films Electronic Optical and Magnetic Materials Microelectronics Wafer Electrical and Electronic Engineering Safety Risk Reliability and Quality business |
| Zdroj: | Microelectronics Reliability. 55:2135-2141 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2015.07.016 |
| Popis: | Plasma FIB is relatively new technique that is growing but it is growing fast to respond to larger and larger application field requests. Born to provide large milling areas at wafer levels, it offers many solutions to investigate new complex embedded systems in particular multi-chips packages, MEMS devices …. Some applications have been experimented on a large range of products in the last year in ST Microelectronics failure analysis laboratory and this paper is an illustration of the potentialities of the technique. New hardware improvements are rising to fasten more and more the analyses, to increase the success rate in case of defect analysis and to fit better with new technologies. |
| Databáze: | OpenAIRE |
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