Photoresist ashing technology using N2/O2 ferrite-core ICP in the dual damascene process

Autor:	Dae Kyu Choi, Sung Kyeong Kim, Chin-Wook Chung, Jong Woo Lee, Jae Min Myoung, Jeong Yeol Jang, Geun Young Yeom, Tae Ho Yoon, Hyoun Woo Kim, Hyungsun Kim, Hyoung June Kim, Ju Hyun Myung, Keeho Kim
Rok vydání:	2006
Předmět:	Materials science Mechanical Engineering Metallurgy Copper interconnect Analytical chemistry Low-k dielectric Integrated circuit Photoresist Ferrite core law.invention Ashing Mechanics of Materials law General Materials Science Photolithography Inductively coupled plasma
Zdroj:	Journal of Materials Science. 41:5040-5042
ISSN:	1573-4803 0022-2461
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::134fe783e55bf933b160144c1e09111b https://doi.org/10.1007/s10853-006-0132-6 Zobrazit plný text záznamu