Process window improvement for fin cut layer in self-aligned double-patterning process based on backscattered electron imaging

Autor: Yu Zhang, David Wei Zhang, Yuyang Bian, Biqiu Liu, Cong Zhang, Jun Huang, Jiawang Song, Yang Gao, Qiang Zhou, Wei Chen, Siqun Xiao, Shmuel Ben Nissim, Kevin Houchens, Omri Baum, Amit Zakay, Tal Ayzik, Yaniv Abramovitz
Rok vydání: 2022
Zdroj: Journal of Micro/Nanopatterning, Materials, and Metrology. 21
ISSN: 2708-8340
DOI: 10.1117/1.jmm.21.4.041605
Databáze: OpenAIRE