In Situ TEM Observations of Cu6Sn5 Polymorphic Transformations in Reaction Layers Between Sn-0.7Cu Solders and Cu Substrates
| Autor: | Kazuhiro Nogita, Syo Matsumura, Eishi Tanaka, Mohd Arif Anuar Mohd Salleh, Stuart McDonald, Guang Zeng |
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| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
In situ Materials science Metallurgy General Engineering 02 engineering and technology 021001 nanoscience & nanotechnology 01 natural sciences Focused ion beam Isothermal process Stress (mechanics) Transmission electron microscopy Phase (matter) Soldering 0103 physical sciences General Materials Science Composite material 0210 nano-technology Monoclinic crystal system |
| Zdroj: | JOM. 68:2871-2878 |
| ISSN: | 1543-1851 1047-4838 |
| DOI: | 10.1007/s11837-016-2020-0 |
| Popis: | Direct evidence of the relationship between the polymorphic phase transformation from monoclinic Cu6Sn5 to hexagonal Cu6Sn5 and stress accumulation/release in Cu6Sn5, formed at the interface between Sn-0.7Cu lead-free solder and their Cu substrates, has been obtained. To explore this challenging phenomenon, we developed an in situ heating/isothermal observation technique in ultrahigh-voltage transmission electron microscopy that enables the observation of thick samples (around 0.5 μm) for solder joints, including Cu/Cu3Sn/Cu6Sn5/Sn-0.7Cu solder interfaces prepared by a focused ion beam milling technique. The results show evidence of stress creation and release events by imaging bend contours that may arise due to the polymorphic transformations of the Cu6Sn5 phase and the associated volumetric change. |
| Databáze: | OpenAIRE |
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