Autor: |
C.S. Liu, Xun Sheng Zhu, Bo Zhao, Feng Jiao |
Rok vydání: |
2008 |
Předmět: |
|
Zdroj: |
Key Engineering Materials. :263-267 |
ISSN: |
1662-9795 |
DOI: |
10.4028/www.scientific.net/kem.375-376.263 |
Popis: |
A new ultrasonic aided lapping technology was developed by combining lapping technology and ultrasonic machining technology. The appended special tangential ultrasonic vibration changes the material removal rate (MRR) characteristics. In order to clarify the influence of ultrasonic vibration, in this paper, the MRR models in ultrasonic aided single-point scratch were deduced based on indentation fracture theory. Through contrast scratching and lapping experiments, the MRR characteristics in ultrasonic aided lapping of engineering ceramics were presented. Research result shows that the MMR in ultrasonic aided lapping is larger than that in conventional lapping under the same conditions; with the increase of ultrasonic generator power and lapping pressure, the MMR in lapping increases correspondingly. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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