| Popis: |
With the PTFE substrate surface and the copper foil surface of High-frequency PCBs as the objects of the research, the influence of various surface treatment technologies on the bonding properties of adhesion was introduced. It was showed that the bonding strength of PTFE substrate surface treated by plasma treatment or none treatment was higher than its material strength. The surface of copper foil was treated by various surface treatment technologies before bonding, such as browning, tin-cerium alloy electroplating, silver plating chemically and gold electroplating. It was showed that the tensile shear strength of copper foil surface with browning treatment was the highest, which was 9.3 MPa. |
