Electrochemical Behavior of Tin and Silver during the Electrorecycling of Pb-free Solder (Sn-Ag-Cu) Waste

Autor: Min-seuk Kim, Jae-chun Lee, Rina Kim, Kyeong-woo Chung
Rok vydání: 2022
Zdroj: Resources Recycling. 31:61-72
ISSN: 2765-3447
2765-3439
DOI: 10.7844/kirr.2022.31.3.61
Databáze: OpenAIRE