Solder Joint Reliability Assessment on FO-CSP for Next Generation DDR6

Autor:	Vance Liu, Jian-Ming Chen, Ji-An Pan, Koustav Sinha, CL Gan, Chan Yoo, Hem Takiar
Rok vydání:	2022
Zdroj:	2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::1205631643836e431340ae87be9891b8 https://doi.org/10.1109/eptc56328.2022.10013142 Zobrazit plný text záznamu