Solder Joint Reliability Assessment on FO-CSP for Next Generation DDR6
Autor: | Vance Liu, Jian-Ming Chen, Ji-An Pan, Koustav Sinha, CL Gan, Chan Yoo, Hem Takiar |
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Rok vydání: | 2022 |
Zdroj: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC). |
Databáze: | OpenAIRE |
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