Thermal investigation of high-power photodiodes
| Autor: | Brian M. Foley, Joe C. Campbell, Xiaojun Xie, Ramez Cheaito, John T. Gaskins, Patrick E. Hopkins, Yang Shen |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
Materials science
business.industry chemistry.chemical_element Diamond 02 engineering and technology Nitride engineering.material Photodiode law.invention 020210 optoelectronics & photonics Thermal conductivity Electricity generation chemistry Aluminium law Thermal 0202 electrical engineering electronic engineering information engineering engineering Optoelectronics business Electrical impedance |
| Zdroj: | 2017 IEEE Photonics Conference (IPC). |
| DOI: | 10.1109/ipcon.2017.8116003 |
| Popis: | The performance of high power photodiodes flip-chip bonded on multi-crystal aluminum nitride (AlN), single-crystal AlN, and diamond submounts are compared. The thermal boundary conductance of submount-Ti interfaces was measured and found to be the primary impedance to heat dissipation. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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