| Autor: |
Ciprian Florea, Adrian Bojita, Marius Purcar, Vasile Topa, Dan Simon, Cristian Boianceanu |
| Rok vydání: |
2018 |
| Předmět: |
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| Zdroj: |
Proceedings of the 1st International Conference on Numerical Modelling in Engineering ISBN: 9789811322723 |
| Popis: |
Thermal Induced Plastic Metal Deformation (TPMD) in a double-diffused metal-oxide semiconductor (DMOS) power device is highly dependent on the design and material properties of the metallization system corresponding to the technology in which the device is fabricated. To analyse and understand the interactions between the temperature, stress and strain distribution in the metallization system, a simple substructure model is necessary. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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