Amorphous silica glass nano-grooving behavior investigated using molecular dynamics method
| Autor: | Yuan-Ching Lin, Chung-Yen Wu |
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| Rok vydání: | 2022 |
| Předmět: | |
| Zdroj: | Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture. 236:1443-1452 |
| ISSN: | 2041-2975 0954-4054 |
| Popis: | This work uses molecular dynamics to simulate the grooving behavior of optical silica glass. The amorphous SiO2 (silica glass) was fabricated using a melting-quenching process, and the critical cut depth, and mechanism of the chip formation, were explored using a molecular dynamics simulation. The analytical results indicated that the tool edge radius affected the critical cut depth and roughness of the machined surface. A larger tool edge radius had a larger equivalent negative rake angle at the same depth of cut, causing a larger critical cut depth, while producing a smoother machined surface. In addition, the uncut chip thickness affected the tangential force and thrust force distribution weighting of the tool. The temperature field analysis revealed that a groove formed by the chip formation mechanism resulted in a higher workpiece temperature, causing the brittle material to exhibit ductile cutting behavior during the nanogrooving process. However, grooves formed by the scratching-indenting mechanism had a lower workpiece temperature. |
| Databáze: | OpenAIRE |
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