Thermally-Aware Modeling and Performance Analysis of Mixed-MWCNTB as Very Large Scale Integrated Interconnects Material for Nano-Electronic Integrated Circuits Design

Autor: Pardeep Kumar Jindal, Karmjit Singh Sandha
Rok vydání: 2019
Předmět:
Zdroj: Journal of Nanoelectronics and Optoelectronics. 14:1255-1266
ISSN: 1555-130X
DOI: 10.1166/jno.2019.2635
Databáze: OpenAIRE