Metal Distribution in Jet Plating
| Autor: | C. Karakus, D. ‐T. Chin |
|---|---|
| Rok vydání: | 1994 |
| Předmět: |
Jet (fluid)
Renewable Energy Sustainability and the Environment Chemistry Nozzle Inorganic chemistry Condensed Matter Physics Cathode Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention Anode law Plating Materials Chemistry Electrochemistry Composite material Electric current Electroplating Current density |
| Zdroj: | Journal of The Electrochemical Society. 141:691-697 |
| ISSN: | 1945-7111 0013-4651 |
| DOI: | 10.1149/1.2054793 |
| Popis: | Jet plating is a high-speed electroplating technique. Due to its special flow characteristics it can be used to localize the electrodeposition reaction on an unmasked cathode. In this process, a jet of plating solution is directed to a cathode surface, and electroplating is done by applying an electric field between the cathode and an anode located in the jet nozzle. The electric current travels along the jet stream to the cathode, and electrodeposition reaction takes places locally only on the area where the jet impinges on the cathode surface. The objective of this study is to find the metal thickness distribution on the cathode surface as a function of current density, electrolyte composition, electrolyte velocity, and nozzle height |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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